Monday, December 28, 2015

HDI PCB with Blind-Buried Via from JAAPSON

This week,  we finished production for a very difficult HDI PCB with mixed blind vias and buried vias. It took us 15 days to finish samples, because it need many extra lamination process. Our customer is very satisfied with our work and quality.  Upon customer's agreement, here below I share some photos.
8 Layer HDI PCB
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing
Application: Medical, Aerospace, Telecommunications, Robotics, embedded





Baggio WANG FAN
SHENZHEN JAAPSON TECHNOLOGY CO LTD
baggio@jaapson-pcb.com  
www.jaapsonpcb.com
skype: baggiowang0214
JAAPSON, Expert in HDI Multi-layer PCB Manufacturing




Monday, August 17, 2015

Breaking the Embedded Bottleneck

Following the overall trend in electronic design, more and more of embedded system development is being pushed onto silicon. To justify skyrocketing mask-set costs, it is becoming necessary that these ASIC designs be used across multiple products. That is why many system-on-a-chip (SOC) designs are targeted at high-volume markets-either across multiple applications (application-specific standard products) or in consumer/mobile applications with high-volume and stringent power requirements.
To achieve the required flexibility and programmability needed to deploy an ASIC in numerous products, many designers are integrating general-purpose processors directly into the ASIC design.

The embedded communications arena is experiencing this same shift in a slightly different way. There has been an explosion in design starts for the Internet infrastructure, but the compressed design cycles demanded by the Internet are driving designers to use off-the-shelf intellectual property (IP) wherever possible. Fortunately, a rich set of standard communications IP (for Ethernet, for example) is now available within specialized processors tailored for communications processor cores like the MPC8260. Instead of using general-purpose processors, embedded communication designers are pairing these powerful communication processors with their own ASIC designs. The problem is the hardware and software interface between these large, sophisticated chips, which has proven extremely complex and difficult to debug.

The trend toward incorporating processors into embedded ASIC design directly impacts verification, making it a much longer and more challenging process. A satisfactory approach for modeling and verifying these extremely challenging systems has been elusive. Meanwhile, demand for a comprehensive modeling solution continues to mount as time-to-market pressures intensify and the cost of failure explodes due to expensive fabrication.

What is needed is a way to simulate the software running against the custom chip in simulation. Only in simulation can you get the required level of visibility and control to properly verify and debug the hardware/software interface. Waiting to verify the interaction until the chip reaches a physical prototype is too late in the design cycle. If something is indeed wrong with the embedded system, it is extremely costly and time-consuming to rectify the problem at this stage in the process. The design team can elect to fix the problem in one of two ways. First, it can choose the workaround route, which usually means moving functionality from the hardware into the software, resulting in less-than-optimal performance. Or second, it can opt to respin the ASIC, meaning it will get to market much later than desired.

The verification problem is especially acute in embedded communication products that rely on advanced processors. The processor core itself, say the MPC8260, is fairly straightforward to simulate in these applications. What makes the verification task so complex is the surrounding circuitry. The peripheral circuitry typically includes super-fast Ethernet ports, multiple bidirectional serial ports, PCI buses, LCD screen-drivers and even SAR outputs, among others. With all that functionality, there are thousands of different software states that need to be examined to fully exercise and verify these systems. The lack of sufficiently accurate models for simulation has, however, made it virtually impossible to perform useful verification before physical prototype.
One way to circumvent the verification problem for embedded designs that integrate a general-purpose or communications processor is to use FPGAs instead of ASICs. This approach significantly lowers manufacturing costs while providing a flexible environment for making modifications. Unfortunately, advanced embedded systems demand much more density than today's FPGAs can deliver, especially when a processor core is included.

A modified approach is to rely on FPGAs just for assessing system performance before first silicon and then casting the design in silicon once verification is complete. Using FPGAs as a verification test bench does, unfortunately, have some drawbacks. Putting a large design into FPGAs is difficult, but it is even more painful moving it back to the ASIC flow afterward, especially with respect to timing. Designers are also denied critical visibility into the flow of software in the processor core during verification.

To provide a more comprehensive solution, tools are now emerging that enable both the hardware and software teams to thoroughly verify complex embedded systems before committing to a physical prototype and without having to rely on FPGAs. This co-verification environment enables the hardware and software teams to use each other's work throughout the design cycle to ensure that the overall embedded system will meet its design goals.

Take the embedded communications challenge, for example. Here, this innovative solution provides the best of both worlds by combining the accuracy of hardware modeling with the speed and visibility of simulation, using a processor model as the link between the hardware and software worlds. It models the communications processor using an instruction set simulator (ISS) in place of the actual silicon core. This gives designers a clear view into the internal operations of the core. Then a hardware modeler is used in conjunction with the ISS to precisely model the detailed activity of the surrounding circuitry. A bus-functional model, a hardware model and an initialization memory model are in a high-level modeling language such as Verilog executed by the simulator. The ISS is in C, linked to the bus-functional model.

With its unique combination of a hardware modeler and a software simulator, this co-verification-modeling environment creates a fast, realistic modeling solution for embedded applications that include ASICs and processors. Now it is possible for the software team to run its code on an extremely accurate circuit description throughout the development cycle. At the same time, the hardware designers have direct access to the latest software to generate the type of intricate behavior they need to thoroughly exercise the complex peripheral environment.
Using this co-verification environment, embedded system designers of all kinds can now move their challenging processor-based designs to market much faster. In addition, their ability to see into the system's operation before the physical prototype stage dramatically improves the design's chances of first-pass success.



Baggio WANG FAN
-----------------------------------------------------------
SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: baggiowang0214
baggio.wang@funsunpcb.com
baggio@jaapson-pcb.com
www.jaapsonpcb.com
JAAPSON, The Expert in HDI Multi-layer PCBs

Wednesday, July 29, 2015

Ball Grid Array (BGA)-JAAPSON PCB

The capability of minimizing the values of the distinctive parameters of the Ball Grid Array technology (BGA) is a basic requirement to give and adequate answer to the requests for increasing miniaturization, coming from quite all the electronic sectors.

JAAPSON PCB is more than able to respect the most restrictive technical requirements. Being nowadays BGA pitches of 0.5 mm, JAAPSON R&D laboratories already realized a BGA pitch of 0.3 mm, exceeding the actual limits set by SMT (Surface Mounting Technology).


 

Capabilities
Pitch*
Outer Layer
400 μm
 
Inner Layer
400 μm
Pad**
Outer Layer
300 μm
 
Inner Layer
230 μm
Track
Outer Layer
25 μm
 
Inner Layer
25 μm
Insulation
Outer Layer
25 μm
 
Inner Layer
25 μm
Vias Diameter
Laser
40 μm
 
Mechanical
50 μm
* on customer request Pitch outer and inner layer 200 μm
** on customer request Pad outer and inner layer 200 μm




SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: jaapsoncircuits
lisa@jaapson-pcb.com
www.jaapsonpcb.com

JAAPSON, The Expert in HDI Multi-layer PCBs

 



Capped Via (Via in Pad)


Capped vias is a technology that allows to design VIP (via in pad) because of flatness surface. Copper via filling as resin via filling plus copper capping are the two main technological solution available today.


The increasing request for printed circuit boards miniaturization, typical of some market sectors, led engineers to design very complex PCB layouts, often inserting interconnecting holes into the BGA pads. So doing the same pad is used both for realizing the internal circuitry of the board (putting in communication the different layers) and its natural SMT use. The advantage resides in a significant reduction of the board size, the disadvantage in the enhanced complexity of the SMD components mounting procedure and the introduction of potential reliability lacks into the assembled board.


When a hole is present in a pad, where a SMD component has to be mounted on, a significant quantity of the exposy glue can flow into the hole generating a void (dry joint) that can influence the liability of the component and/or a sudden break of the component connection to the board.


As mentioned above, two different approaches, but not completely alternative, can be used to solve these kind of problems: filling copper and capped vias.
The filling copper technology requires the deposition of extra copper into the hole, until the requested filling percentage is obtained: to not compromise the thickness of the pad (the deposition, even in very small percentage, affects also the pad) a dimple is always present and a perfect planarity can not be guaranteed.


Some SMD components do not require planarity, some other does: in this last case the capped vias technology is the only solution.
The capped vias technology requires the hole to be filled with resin and then plated: an extra, very thin, copper cap is so superimposed to the pad. The advantage resides in the preservation of the interconnections realised by the hole and the absolutely perfect planarity of the pad, that allows to each component to be easily mounted.


The capped vias technology can be used also in another situation, involving buried vias instead of laser vias (BGA pads) as above.


Because of the mechanical processes the printed circuit boards are subjected to, when the SBU technology is applied, the plating of the buried vias can be affected by some micro-break at each corner. The risk is obvious: the malfunctioning or the break of the interconnections realised by the buried via and the following unreliability of the assembled board. To avoid this potential problem, the buried vias are filled with resin and plated. This process, in fact, give robustness to the via and preserve the board desired performance.
 
 
 
 
 
Baggio WANG FAN
-----------------------------------------------------------
SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: baggiowang0214
baggio.wang@funsunpcb.com
baggio@jaapson-pcb.com
www.jaapsonpcb.com
JAAPSON, The Expert in HDI Multi-layer PCBs

Sunday, July 19, 2015

Rigid Flex PCB Manufacturing in China




What is a Rigid Flex PCB?

 

Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 

 





 

Baggio WANG FAN

-----------------------------------------------------------

SHENZHEN JAAPSON TECHNOLOGY CO LTD

Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104

Tel: 86-755-82596922

Fax:86-755-82596922/82596923

skype: baggiowang0214




 

JAAPSON, The Expert in HDI Multi-layer PCBs

Wednesday, July 1, 2015

what is embedded system





An embedded system is a computer system with a dedicated function within a larger mechanical or electrical system, often with real-time computing constraints. It is embedded as part of a complete device often including hardware and mechanical parts. Embedded systems control many devices in common use today.

Properties typical of embedded computers when compared with general-purpose ones are e.g. low power consumption, small size, rugged operating ranges and low per-unit cost. This comes at the price of limited processing resources, which make them significantly more difficult to program and to interface with. However, by building intelligence mechanisms on the top of the hardware, taking advantage of possible existing sensors and the existence of a network of embedded units, one can both optimally manage available resources at the unit and network levels as well as provide augmented functionalities, well beyond those available. For example, intelligent techniques can be designed to manage power consumption of embedded systems.

Modern embedded systems are often based on microcontrollers (i.e. CPUs with integrated memory or peripheral interfaces) but ordinary microprocessors (using external chips for memory and peripheral interface circuits) are also still common, especially in more complex systems. In either case, the processor(s) used may be types ranging from general purpose to those specialised in certain class of computations, or even custom designed for the application at hand. A common standard class of dedicated processors is the digital signal processor (DSP).

Since the embedded system is dedicated to specific tasks, design engineers can optimize it to reduce the size and cost of the product and increase the reliability and performance. Some embedded systems are mass-produced, benefiting from economies of scale.

Embedded systems range from portable devices such as digital watches and MP3 players, to large stationary installations like traffic lights, factory controllers, and largely complex systems like hybrid vehicles, MRI, and avionics. Complexity varies from low, with a single microcontroller chip, to very high with multiple units, peripherals and networks mounted inside a large chassis or enclosure.




Baggio WANG FAN
-----------------------------------------------------------
SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: baggiowang0214

JAAPSON, The Expert in HDI Multi-layer PCBs

HDI-Multi-layer-PCB

HDI is the abbreviation for High Density Interconnector. HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology.

HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the
device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. HDI PCB is the best alternative to high layer-countand expensive standard laminate or sequentially laminated boards.

Concerning the electrical requirements for high-speed signal, the PCB must possess some AC characteristics, such as impedance control, high-frequency transmission capability and reduce unnecessary radiation. Multi-layered design is necessary for the structure of Stripline and Microstrip. In order to lesson the quality issues of signal transmission, the insulating material with low dielectric factor and low attenuation ratio is applied. Duo to the miniaturization and arrays of the electronic components, the PCB must be improved in the density. Along with the outcome of the assembling methods of Ball Grid Array, Chip Scale Package and Direct Chip Attachment, the PCB is featured with unprecedented high-density. The hole with a diameter less than 150um is known as Microvia. It can improve the effectiveness of assembly and space utilization and so on. It’s also necessary for the miniaturization of electronic products.

There were a lot of different names for the PCB with such structures. For example, it was called SBU (Sequence Build up the Process) in European and American industry as the program production is in the constructive mode of sequence. It was called MVP (Microvia Process) in Japanese industry because the hole of such products is much smaller than the previous one. It was also called BUM (Build up Multilayer Board) because the traditional multilayer is known as MLB (Multilayer Board).In order to avoid confusion, IPC Printed Circuit Association proposed to call it HDI (High Density Interconnection Technology) as the common name, but it can not reflect the characteristics of the circuit board. So the majority in the PCB industry define such products as HDI PCB.

There are a lot of advantages with HDI PCB, such as small size, high speed and high frequency. It is the main components of personal computers, portable computers, mobile phones and personal digital assistants. At present, except mobile phones, HDI PCB is also widely used in a variety of other consumer products, such as game consoles and MP3, etc. In addition, the applying of HDI PCB in notebook computer is expected trend since 2006 is in the industry.




Baggio WANG FAN
-----------------------------------------------------------
SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: baggiowang0214

JAAPSON, The Expert in HDI Multi-layer PCBs