HDI PCB with Blind-Buried Via from JAAPSON

This week,  we finished production for a very difficult HDI PCB with mixed blind vias and buried vias. It took us 15 days to finish samples, because it need many extra lamination process. Our customer is very satisfied with our work and quality.  Upon customer's agreement, here below I share some photos.

8 Layer HDI PCB
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing
Application: Medical, Aerospace, Telecommunications, Robotics, embedded

Baggio WANG FAN

SHENZHEN JAAPSON TECHNOLOGY CO LTD

baggio@jaapson-pcb.com  

www.jaapsonpcb.com

skype: baggiowang0214

JAAPSON, Expert in HDI Multi-layer PCB Manufacturing

Ball Grid Array (BGA)-JAAPSON PCB

The capability of minimizing the values of the distinctive parameters of the Ball Grid Array technology (BGA) is a basic requirement to give and adequate answer to the requests for increasing miniaturization, coming from quite all the electronic sectors.

JAAPSON PCB is more than able to respect the most restrictive technical requirements. Being nowadays BGA pitches of 0.5 mm, JAAPSON R&D laboratories already realized a BGA pitch of 0.3 mm, exceeding the actual limits set by SMT (Surface Mounting Technology).

 

Capabilities
Pitch*	Outer Layer	400 μm
	Inner Layer	400 μm
Pad**	Outer Layer	300 μm
	Inner Layer	230 μm
Track	Outer Layer	25 μm
	Inner Layer	25 μm
Insulation	Outer Layer	25 μm
	Inner Layer	25 μm
Vias Diameter	Laser	40 μm
	Mechanical	50 μm
* on customer request Pitch outer and inner layer 200 μm
** on customer request Pad outer and inner layer 200 μm

SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: jaapsoncircuits
lisa@jaapson-pcb.com
www.jaapsonpcb.com
JAAPSON, The Expert in HDI Multi-layer PCBs