This week, we finished production for a very difficult HDI PCB with mixed blind vias and buried vias. It took us 15 days to finish samples, because it need many extra lamination process. Our customer is very satisfied with our work and quality. Upon customer's agreement, here below I share some photos.
8 Layer HDI PCB
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing
Application: Medical, Aerospace, Telecommunications, Robotics, embedded
Blind vias, L1-L2, L7-L8
Buried vias, L2-L7
BGA work
line width/space: 3mil/3mil
ENIG finishing
Application: Medical, Aerospace, Telecommunications, Robotics, embedded
Baggio WANG FAN
SHENZHEN JAAPSON TECHNOLOGY CO LTD
baggio@jaapson-pcb.com
www.jaapsonpcb.com
skype: baggiowang0214
JAAPSON, Expert in HDI Multi-layer PCB Manufacturing
